ZLP36B/40B/50B Smart Ring-Brusher (Blubber Clank)
The machine bed is a fine-soft polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon, mechanical parts, etc. The machine-bed PLC digital program control mode controls the various operating procedures independently, with the functions of a no-facility, timing control, count control, sequence control, remote fail alert, etc. for the various transmission systems.
Specification Snapshot
Dimensions [Parameter graphs 1.png; ZLP36B column; independent source of the product; specification table text rows]
4800 mm × 4500 mm × 1950 mm
Dimensions [Parameter graphs 1.png; ZLP40B column; independent source of the product; specification table text rows]
5200 mm × 4950 mm × 1950 mm
Dimensions [Parameter graphs 1.png; ZLP50B column; independent source of the product; specification table text rows]
5800 mm × 5200 mm × 1950 mm
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Overview
The machine bed is a fine-soft polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon, mechanical parts, etc. The machine-bed PLC digital program control mode controls the various operating procedures independently, with the functions of a no-facility, timing control, count control, sequence control, remote fail alert, etc. for the various transmission systems.
Specifications
| Parameter | Value |
|---|---|
| Graft size (gravitate) [Parameter graphs 1.png; ZLP36B column; independent source of the product] | Φ3600 |
| Project Ring Size [Parameter graphs 1.png; ZLP36B column; independent source of the product; source unmarked unit] | Φ1500 × Φ1300 × 80 |
| Single Point [Parameter graphs 1.png; ZLP36B column; independent source of the product] | ≤0.015 mm |
| On-board beat [Parameter graphs 1.png; ZLP36B column; independent source of the product] | ≤0.15 mm |
| Correct Disk Specification [Parameter graphs 1.png; ZLP36B column; independent source of the product] | Φ1880 mm × 120 mm |
| The grinder's turning speed. [Parameter graphs 1.png; ZLP36B column; independent source of the product; infinity; preservation of commas and decimal points] | 0,0.5~1.5 |
| Processing Range [Parameter graphs 1.png; ZLP36B column; independent source of the product] | ≤Φ1300 |
| PLC interface [Parameter graphs 1.png; ZLP36B column; independent source of the product] | MH1500-1(15") |
| Cracket moving distance [Parameter graphs 1.png; ZLP36B column; independent source of the product] | ≤320 mm |
| Total machine-bed power [Parameters 1.png; ZLP36B column; independent source of the product; 380V] | 20 KW |
| Machine bed weight [Parameter graphs 1.png; ZLP36B column; independent source of the product] | Approximately 16000 |
| Dimensions [Parameter graphs 1.png; ZLP36B column; independent source of the product; specification table text rows] | 4800 mm × 4500 mm × 1950 mm |
| Graft size (gravitate) [Parameter graphs 1.png; ZLP40B column; independent source of the product] | Φ4000 |
| Project Ring Size [Parameter graphs 1.png; ZLP40B column; independent source of the product; source unmarked unit] | Φ1800 × Φ1500 × 100 |
| Single Point [Parameter graphs 1.png; ZLP40B column; independent source of the product] | ≤0.015 mm |
| On-board beat [Parameter graphs 1.png; ZLP40B column; independent source of the product] | ≤0.15 mm |
| Correct Disk Specification [Parameter graphs 1.png; ZLP40B column; independent source of the product] | Φ2100 mm × 160 mm |
| The grinder's turning speed. [Parameter graphs 1.png; ZLP40B column; independent source of the product; infinity; preservation of commas and decimal points] | 0,0.4~1 |
| Processing Range [Parameter graphs 1.png; ZLP40B column; independent source of the product] | ≤Φ1500 |
| PLC interface [Parameter graphs 1.png; ZLP40B column; independent source of the product] | MH1500-1(15") |
| Cracket moving distance [Parameter graphs 1.png; ZLP40B column; independent source of the product] | ≤400 mm |
| Total machine-bed power [Parameters 1.png; ZLP40B column; independent source of the product; 380V] | 24 KW |
| Machine bed weight [Parameter graphs 1.png; ZLP40B column; independent source of the product] | Approximately 20000 |
| Dimensions [Parameter graphs 1.png; ZLP40B column; independent source of the product; specification table text rows] | 5200 mm × 4950 mm × 1950 mm |
| Graft size (gravitate) [Parameter 1.png; ZLP50B column; independent source of the product] | Φ5000 |
| Project Ring Size [Parameter graphs 1.png; ZLP50B column; independent source of the product; source unmarked unit] | Φ2100 × Φ1800 × 120 |
| Single Point [Parameter 1.png; ZLP50B column; independent source of the product] | ≤0.015 mm |
| On-board beat [Parameter 1.png; ZLP50B column; independent source of the product] | ≤0.15 mm |
| Correct Disk Specification [Parameter 1.png; ZLP50B column; independent source of the product] | Φ2660 mm × 200 mm |
| The grinder's turning speed. [Parameter graphs 1.png; ZLP50B column; independent source of the product; infinity; preservation of commas and decimal points] | 0,0.3~0.8 |
| Processing Range [Parameter 1.png; ZLP50B column; independent source of the product] | ≤Φ1800 |
| PLC interface [Parameter 1.png; ZLP50B column; independent source of the product] | MH1500-1(15") |
| Cracket moving distance [Parameter 1.png; ZLP50B column; independent source of the product] | ≤400 mm |
| Total machine-bed power [Parameters 1.png; ZLP50B column; independent source of the product; 380V] | 30 KW |
| Machine bed weight [Parameter 1.png; ZLP50B column; independent source of the product] | Approximately 30000 |
| Dimensions [Parameter graphs 1.png; ZLP50B column; independent source of the product; specification table text rows] | 5800 mm × 5200 mm × 1950 mm |
Datasheet
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Supplier Information
Xibin Optoelectronics, full name Xibin Optoelectronics (Jiangsu) Co., Ltd. (established in June 2001 as Wuxi Xibin Optoelectronic Equipment Factory, changed to Wuxi Xibin Optoelectronic Equipment Co., Ltd. in April 2007, established Yancheng Xibin Optoelectronic Technology Co., Ltd. in April 2012, changed to Xibin Optoelectronics (Jiangsu) Co., Ltd. in 2021, and established an optical processing workshop at the end of 2021), is a high-tech enterprise specializing in the research and development, manufacturing and sales of optical cold processing equipment, as well as supporting processing technology and processing devices.
Xibin Optoelectronics has a well-trained, dedicated, and challenge-driven professional technical R&D team. It has long focused on product innovation and has received on-site guidance from Academician Pan Junhua and others.
Main products: intelligent ring polishing machine series, CNC single-axis flipping machine series, pneumatic flat swing precision grinding and polishing machine series, high-speed fine grinding and polishing machine series, variable frequency multi-axis machine series, cylindrical grinding and polishing machine series, intelligent surface milling machine, fully automatic wafer chamfering machine, chamfering machine, centrifuge, etc.
Product application: suitable for fine grinding and polishing of flat, cylindrical and spherical surfaces of materials such as glass, ceramics, sapphire, silicon wafers, mechanical seals, etc.
Technology leadership, reliable quality, and customer satisfaction are the company's purposes. We warmly welcome friends from all walks of life to visit and negotiate, let us work together and develop together! Xibin Optoelectronics is willing to be your trusted partner!
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