Home All Products Optomechanics & Accessories Accessories ZLP30B/36B/40B/50B Smart ring-brusher (Blubber ring-blank)
ZLP30B/36B/40B/50B Smart ring-brusher (Blubber ring-blank)
Accessories

ZLP30B/36B/40B/50B Smart ring-brusher (Blubber ring-blank)

Supplier
Xboecn
Category
Accessories
Origin
China

The machine bed is a fine-simplified polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon chips, mechanical parts, etc. The machine-bed PLC digital program control mode allows for independent control of various operating procedures, which have the ability to operate at a minimum speed, time control, count control, sequence control, remote fail alerts, etc. for the various transmission systems.

Specification Snapshot
Dimensions [Parameter graphs 1.png; ZLP30B column; independent source of the product; specification table text rows]
4400 mm × 3800 mm × 1950 mm
Dimensions [Parameter graphs 1.png; ZLP36B column; independent source of the product; specification table text rows]
4800 mm × 4500 mm × 1950 mm
Dimensions [Parameter graphs 1.png; ZLP40B column; independent source of the product; specification table text rows]
5200 mm × 4950 mm × 1950 mm
Dimensions [Parameter graphs 1.png; ZLP50B column; independent source of the product; specification table text rows]
5800 mm × 5200 mm × 1950 mm
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Overview

The machine bed is a fine-simplified polishing device for flat-cracking elements such as high-precision optical, electronic, ceramic, silicon chips, mechanical parts, etc. The machine-bed PLC digital program control mode allows for independent control of various operating procedures, which have the ability to operate at a minimum speed, time control, count control, sequence control, remote fail alerts, etc. for the various transmission systems.

Specifications

ParameterValue
Graft size (gravitate) [Parameter graphs 1.png; ZLP30B column; independent source of the product]Φ3000
Project Ring Size [Parameter graphs 1.png; ZLP30B column; independent source of the product; source unmarked unit]Φ1200 × Φ1000 × 80
Single Point [Parameter graphs 1.png; ZLP30B column; independent source of the product]≤0.015 mm
On-board beat [Parameter graphs 1.png; ZLP30B column; independent source of the product]≤0.10 mm
Correct Disk Specification [Parameter graphs 1.png; ZLP30B column; independent source of the product]Φ1570 mm × 120 mm
The grinder's turning speed. [Parameter graphs 1.png; ZLP30B column; independent source of the product; infinity; preservation of commas and decimal points]0,0.8～2
Processing Range [Parameter graphs 1.png; ZLP30B column; independent source of the product]≤Φ1000
PLC interface [Parameter graphs 1.png; ZLP30B column; independent source of the product]MH1500-1(15")
Cracket moving distance [Parameter graphs 1.png; ZLP30B column; independent source of the product]≤280 mm
Total machine-bed power [Parameters 1.png; ZLP30B column; independent source of the product; 380V]16 kW
Machine bed weight [Parameter graphs 1.png; ZLP30B column; independent source of the product]Approximately 12500
Dimensions [Parameter graphs 1.png; ZLP30B column; independent source of the product; specification table text rows]4400 mm × 3800 mm × 1950 mm
Graft size (gravitate) [Parameter graphs 1.png; ZLP36B column; independent source of the product]Φ3600
Project Ring Size [Parameter graphs 1.png; ZLP36B column; independent source of the product; source unmarked unit]Φ1500 × Φ1300 × 80
Single Point [Parameter graphs 1.png; ZLP36B column; independent source of the product]≤0.015 mm
On-board beat [Parameter graphs 1.png; ZLP36B column; independent source of the product]≤0.15 mm
Correct Disk Specification [Parameter graphs 1.png; ZLP36B column; independent source of the product]Φ1880 mm × 120 mm
The grinder's turning speed. [Parameter graphs 1.png; ZLP36B column; independent source of the product; infinity; preservation of commas and decimal points]0,0.5～1.5
Processing Range [Parameter graphs 1.png; ZLP36B column; independent source of the product]≤Φ1300
PLC interface [Parameter graphs 1.png; ZLP36B column; independent source of the product]MH1500-1(15")
Cracket moving distance [Parameter graphs 1.png; ZLP36B column; independent source of the product]≤320 mm
Total machine-bed power [Parameters 1.png; ZLP36B column; independent source of the product; 380V]20 kW
Machine bed weight [Parameter graphs 1.png; ZLP36B column; independent source of the product]Approximately 16000
Dimensions [Parameter graphs 1.png; ZLP36B column; independent source of the product; specification table text rows]4800 mm × 4500 mm × 1950 mm
Graft size (gravitate) [Parameter graphs 1.png; ZLP40B column; independent source of the product]Φ4000
Project Ring Size [Parameter graphs 1.png; ZLP40B column; independent source of the product; source unmarked unit]Φ1800 × Φ1500 × 100
Single Point [Parameter graphs 1.png; ZLP40B column; independent source of the product]≤0.015 mm
On-board beat [Parameter graphs 1.png; ZLP40B column; independent source of the product]≤0.15 mm
Correct Disk Specification [Parameter graphs 1.png; ZLP40B column; independent source of the product]Φ2100 mm × 160 mm
The grinder's turning speed. [Parameter graphs 1.png; ZLP40B column; independent source of the product; infinity; preservation of commas and decimal points]0,0.4～1
Processing Range [Parameter graphs 1.png; ZLP40B column; independent source of the product]≤Φ1500
PLC interface [Parameter graphs 1.png; ZLP40B column; independent source of the product]MH1500-1(15")
Cracket moving distance [Parameter graphs 1.png; ZLP40B column; independent source of the product]≤400 mm
Total machine-bed power [Parameters 1.png; ZLP40B column; independent source of the product; 380V]24 kW
Machine bed weight [Parameter graphs 1.png; ZLP40B column; independent source of the product]Approximately 20000
Dimensions [Parameter graphs 1.png; ZLP40B column; independent source of the product; specification table text rows]5200 mm × 4950 mm × 1950 mm
Graft size (gravitate) [Parameter 1.png; ZLP50B column; independent source of the product]Φ5000
Project Ring Size [Parameter graphs 1.png; ZLP50B column; independent source of the product; source unmarked unit]Φ2100 × Φ1800 × 120
Single Point [Parameter 1.png; ZLP50B column; independent source of the product]≤0.015 mm
On-board beat [Parameter 1.png; ZLP50B column; independent source of the product]≤0.15 mm
Correct Disk Specification [Parameter 1.png; ZLP50B column; independent source of the product]Φ2660 mm × 200 mm
The grinder's turning speed. [Parameter graphs 1.png; ZLP50B column; independent source of the product; infinity; preservation of commas and decimal points]0,0.3～0.8
Processing Range [Parameter 1.png; ZLP50B column; independent source of the product]≤Φ1800
PLC interface [Parameter 1.png; ZLP50B column; independent source of the product]MH1500-1(15")
Cracket moving distance [Parameter 1.png; ZLP50B column; independent source of the product]≤400 mm
Total machine-bed power [Parameters 1.png; ZLP50B column; independent source of the product; 380V]30 kW
Machine bed weight [Parameter 1.png; ZLP50B column; independent source of the product]Approximately 30000
Dimensions [Parameter graphs 1.png; ZLP50B column; independent source of the product; specification table text rows]5800 mm × 5200 mm × 1950 mm

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Supplier Information

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Xibin Optoelectronics, full name Xibin Optoelectronics (Jiangsu) Co., Ltd. (established in June 2001 as Wuxi Xibin Optoelectronic Equipment Factory, changed to Wuxi Xibin Optoelectronic Equipment Co., Ltd. in April 2007, established Yancheng Xibin Optoelectronic Technology Co., Ltd. in April 2012, changed to Xibin Optoelectronics (Jiangsu) Co., Ltd. in 2021, and established an optical processing workshop at the end of 2021), is a high-tech enterprise specializing in the research and development, manufacturing and sales of optical cold processing equipment, as well as supporting processing technology and processing devices. Xibin Optoelectronics has a well-trained, dedicated, and challenge-driven professional technical R&D team. It has long focused on product innovation and has received on-site guidance from Academician Pan Junhua and others. Main products: intelligent ring polishing machine series, CNC single-axis flipping machine series, pneumatic flat swing precision grinding and polishing machine series, high-speed fine grinding and polishing machine series, variable frequency multi-axis machine series, cylindrical grinding and polishing machine series, intelligent surface milling machine, fully automatic wafer chamfering machine, chamfering machine, centrifuge, etc. Product application: suitable for fine grinding and polishing of flat, cylindrical and spherical surfaces of materials such as glass, ceramics, sapphire, silicon wafers, mechanical seals, etc. Technology leadership, reliable quality, and customer satisfaction are the company's purposes. We warmly welcome friends from all walks of life to visit and negotiate, let us work together and develop together! Xibin Optoelectronics is willing to be your trusted partner!

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