Semi-Automatic Liquid Wax Mounting Machine TLB-485S
The series is a semi-automatic liquid wax paste, which is automatically completed by hand, removing the handling ceramic dishes, by drip wax, waxing, baking, pasting, using a gasket, waxing, high-precision, and is suitable for the paste of various semiconductor underline materials. Product characteristics: full functionality: air-screech, high wax accuracy; waxing: dropper-screaking-baking-baking-cladding-cooling; operation simple: drip wax, waxing, baking, baking, crushing; large configuration: cold water sets, waxing; compatibility: fit for a 360/485 mm ceramic plate; programmable to switch
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Overview
The series is a semi-automatic liquid wax paste, which is automatically completed by hand, removing the handling ceramic dishes, by drip wax, waxing, baking, pasting, using a gasket, waxing, high-precision, and is suitable for the paste of various semiconductor underline materials. Product characteristics: full functionality: air-screech, high wax accuracy; waxing: dropper-screaking-baking-baking-cladding-cooling; operation simple: drip wax, waxing, baking, baking, crushing; large configuration: cold water sets, waxing; compatibility: fit for a 360/485 mm ceramic plate; programmable to switch
Specifications
| Parameter | Value |
|---|---|
| Wafer Size | 4-8 in |
| Ceramic plate specifications | OD485 mm |
| Scrap device | Two-stage pressing with airbag + cylinder |
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Supplier Information
Beijing TSD Semiconductor Equipment Co., Ltd. is a national high-tech enterprise with independent intellectual property rights, focusing on the R&D, production, and sales of ultra-precision planar processing equipment for the semiconductor field. With the mission of "leading semiconductor technology progress and assisting customer development", it is committed to becoming a globally leading semiconductor equipment manufacturer.
Guided by the technology orientation of "flatter, thinner, more reliable", TSD deeply cultivates ultra-precision planar processing technology in fields such as semiconductor substrate materials, wafer manufacturing, semiconductor devices, advanced packaging, and MEMS, forming core technical advantages of leading technology, superior performance, and stable processes, and can provide systematic solutions and process equipment for thinning, polishing, and CMP.
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