Fully Automatic Thinning Machine TFG-3250
A fully automatic thinning machine for 6/8-inch wafer grinding, with 3 spindles and 4 stations. Precision spindles, robotic loading/unloading, automatic centering, transfer positioning, cleaning and drying provide fully automatic dry-in/dry-out operation. Automatic thickness measurement, multistage grinding and overload waiting support high accuracy and productivity.
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Overview
Specifications
| Parameter | Value |
|---|---|
| Number of workstations | 4 units |
| Sandwheel Specification | OD303 mm |
| Max. round size | 8 in |
| Sandwheel axle power | 7.5 kw |
Key Features
Datasheet
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Supplier Information
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