Three-Dimensional Laser Direct-Writing Equipment for Photonic Chips PROME-Photonic
Prome-Photonic is a high-performance laser direct-writing system for photonic wire bonding(PWB) in photonic-chip integration. Nanoscale 3D fabrication and precise positioning/alignment address accurate cross-layer interconnection and heterogeneous packaging in three-dimensional photonic-chip integration. Multi-Photon Polymerization(MPP) enables true three-dimensional fabrication of submicron freeform structures, providing an important manufacturing platform for hybrid integration of silicon-photonic chips, lithium-niobate photonic circuits, and quantum-optical devices.
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Founded in 2019, Jilin JC Ultrafast Equipment Co., Ltd. is a high-tech enterprise incubated by the Ultrafast Optoelectronics Center of Jilin University. Our R&D team owns 15 years of profound experience in femtosecond laser micro-nano fabrication.
Wuhan Optical Valley Interlink Technology Co., Ltd. was founded in 2013 by a technical team from Huazhong University of Science and Technology.
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