Wafer Stealth-Dicing Optical System Solutions
Jianxin Optoelectronics uses independently developed hologram algorithms to achieve axial multiple foci, transverse multifocus beam splitting, and beam shaping. Applications include ingot separation, wafer stealth dicing, wafer grooving, trapezoidal/C-shaped glass chamfering, metal 3D printing, laser welding, through-holes in lithium battery electrode materials, solar cell scribing, drilling, and other laser processing applications.
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