Mini/Micro LED Three-Dimensional Laser Etching Equipment
This equipment mainly forms sidewall conductors for Mini/Micro LEDs. Laser processing creates three-dimensional conductive circuits with precision unavailable through conventional printing. Independently developed lasers and optical systems use two optical paths to etch the front, side and back of products. An optional AOI system automatically evaluates etching quality to facilitate targeted rework and review.
Save to Favorites
Overview
Specifications
| Parameter | Value |
|---|---|
| Etching Line Width & Spacing | ≥15μm |
| Post-Etching Stitching Accuracy | ±3μm |
| Etching Efficiency | ≤180s/1000 Wires |
| Corresponding to Dimensions | 3-75Inch |
Applications
Key Features
Datasheet
Please provide your email to download the datasheet.
Invalid email format. Please try again.
Supplier Information
Related Products
-
3D Floating Display Frame (Customizable Logo)
Display Technologies
Cryspack
External dimensions: 200 mm × 50 mm × 25 mm Internal dimensions: 190 mm × 40 mm × 20 mm
The 3D suspension display frame with customizable logo belongs to the M2 elastic-film box series. Elastic film secures precision devices for display, storage and handling. Refer to this page's parameters and actual confirmation for dimensions, materials, compatibility and operating conditions. It is used for packaging, storage, handling or display. See the parameters for dimensions, materials and structure; contact Kangpaike to confirm samples, specifications, materials or customization.
-
AMOLED Cell Cutting Equipment
Display Technologies
Delphilaser
Substrate Cutting Dimensions [Customizable]: ≤1500×925mm(customizable) Applicable Substrate thickness [Glass Substrate or Fully Flexible]: 0.1~0.7mm (glass substrate or purely flexible material)
This equipment cuts AMOLED flexible substrates into specified sizes and quantities of cells and discharges them. Its fully automatic mechanism and independently developed software operating system offer convenient operation, with customization available to customer requirements.
-
LCD Terminal Cutting Equipment ASC Series
Display Technologies
Delphilaser
Cutting material: LCD Working area [Customizable]: 7~100 inch (customizable) Cutting speed: ≥300mm/s
This equipment mainly cuts terminals on LCD products. Terminal shorting-ring technology is mature and widely used, but the ring must be cut when ICs are added to the LCD panel. Laser cutting is an advanced method for this task. Automatic vision positioning, automated handling axes and AOI inspection support different product sizes, ensuring automatic high-speed cutting and stable, high-quality operation.
-
Micro LED Laser Lift-Off Equipment
Display Technologies
Delphilaser
X Axis - Travel: 400mm X-Axis Resolution: 0.1um Y Axis - Travel: 400mm
Laser lift-off processing of Micro LED wafers.
-
Micro LED Laser Mass-Transfer Equipment
Display Technologies
Delphilaser
X Axis - Travel: 400mm X-Axis Resolution: 0.1μm Y Axis - Travel: 400mm
This equipment avoids chip damage during laser mass transfer while ensuring accurate Micro-LED landing positions and configurable array layouts after transfer. Combined with AOI and PL machine mapping, it selectively transfers good chips quickly and accurately.
Related Articles
Founded in November 2017, TIANJIN H‑CHIP TECHNOLOGY GROUP CORPORATION is a professional manufacturing‑service provider dedicated to micro‑nano optoelectronic chips. It holds multiple prestigious qualifications, including National High‑Tech Enterprise, one of Tianjin’s first Gazelle‑certified Enterprises, Specialized‑Refined‑Differentiated‑Innovative SME, and Leading Enterprise for Strategic Emerging Industries.
CytoViva delivers comprehensive hyperspectral imaging solutions covering visible to near-infrared spectrum, compatible with brightfield, fluorescence and proprietary enhanced darkfield microscopy modes.
The LZFL405‑80mW‑3 series from Shenzhen Leirte Optoelectronics Co., Ltd. is a coaxial‑packaged violet‑blue single‑mode fiber‑coupled laser diode. It delivers 80 mW continuous‑wave output at 405 nm. Light is coupled into 3 μm core‑diameter single‑mode fiber for clean beam quality and easy integration into diverse optical systems. It serves as a compact violet‑blue light source for medical instruments and industrial printing applications.
As a top‑tier supplier of tunable laser chips, Shandong Zhongxin Optoelectronics Technology Company has newly launched the world’s first budget‑friendly fiber‑Bragg‑grating (FBG) demodulator and scanning module.
Loading...
Name
Phone
Organization
Use Case
Database Platform