LCD Terminal Cutting Equipment ASC Series

LCD Terminal Cutting Equipment ASC Series

Supplier
Delphilaser
Part Number
ASC系列
Category
Display Technologies
Origin
China

This equipment mainly cuts terminals on LCD products. Terminal shorting-ring technology is mature and widely used, but the ring must be cut when ICs are added to the LCD panel. Laser cutting is an advanced method for this task. Automatic vision positioning, automated handling axes and AOI inspection support different product sizes, ensuring automatic high-speed cutting and stable, high-quality operation.

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Overview

This equipment mainly cuts terminals on LCD products. Terminal shorting-ring technology is mature and widely used, but the ring must be cut when ICs are added to the LCD panel. Laser cutting is an advanced method for this task. Automatic vision positioning, automated handling axes and AOI inspection support different product sizes, ensuring automatic high-speed cutting and stable, high-quality operation.

Specifications

ParameterValue
Cutting materialLCD
Working area [Customizable]7~100 inch (customizable)
Cutting speed≥300mm/s
Cutting accuracy±10μm
Variable Linewidth10μm~280μm
Equipment Structure1 Cutting Head+2 Platforms, Fully Automatic Inline Equipment
Cycle time TT [Calculated for a 32inch Panel]For a 32inch panel, TT≤12S/pcs

Applications

Cutting terminal shorting rings in liquid-crystal display devices; ring materials include Cu/Al/molybdenum-aluminum-molybdenum.

Key Features

AOI and a cutting head enable concurrent cutting and inspection with high efficiency; slag-free cutting lanes and smooth edges; freely adjustable line width and broad compatibility.

Datasheet

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Supplier Information

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Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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LCD Terminal Cutting Equipment ASC Series
Delphilaser · Display Technologies
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