Silicon Carbide Laser Annealing Equipment

Silicon Carbide Laser Annealing Equipment

Supplier
Delphilaser
Category
Optical Material
Origin
China

This equipment performs ohmic annealing of silicon carbide, with automatic die loading and unloading and automatic wafer alignment. It delivers excellent processing results and high efficiency. No consumables are required during operation, keeping processing costs low.

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Overview

This equipment performs ohmic annealing of silicon carbide, with automatic die loading and unloading and automatic wafer alignment. It delivers excellent processing results and high efficiency. No consumables are required during operation, keeping processing costs low.

Applications

Laser annealing of backside metallization on silicon carbide wafers (wafers using silicon carbide as the substrate).

Key Features

Self-manufactured lasers under independent control; broad process window accommodating annealing requirements of other materials; compliance with SEMI industry standards.

Datasheet

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Supplier Information

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Delphilaser
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Suzhou Delphi Laser Co., Ltd., established in 2005 and located in Suzhou Industrial Park, is mainly engaged in the R&D, production and sales of high-end industrial precision laser processing equipment and its core device laser. The company is a technology-driven enterprise, always dedicated to the cutting-edge research and development of new products, technologies and processes. Focusing on the field of laser precision micro-machining, with advanced laser technology, high-precision motion control technology and profound expertise in laser micro-machining processes, it concentrates on application areas such as semiconductors, electronics, photovoltaics, lithium batteries and flat panel displays, providing laser processing solutions for various ultra-thin, ultra-hard, brittle, flexible and composite materials. Through independent research and development, the company has mastered core technologies and industrialized mature products of nanosecond, ultrafast (picosecond, femtosecond) and adjustable pulse width solid-state lasers. The company targets high-tech and frontier applications, conducting cutting-edge R&D on various laser-applied materials and processes, promptly launching precision laser processing solutions, continuously expanding the application fields of laser micro-machining, and assisting the transformation and upgrading of China's manufacturing industry. Currently, the company's products are widely used in the scribing of third-generation semiconductor wafers such as SiC and GaN, MEMS chip cutting, and cutting and processing for Mini LED and 5G antennas. Since its establishment, Delphi Laser has adhered to the corporate spirit of 'integrity, dedication, teamwork, innovation', shouldered the mission of 'exploring the micro-nano world with lasers', strengthened core technology development and market competitiveness, and is committed to becoming a globally influential laser company in the field of precision micro-machining.

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Silicon Carbide Laser Annealing Equipment
Delphilaser · Optical Material
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