Thermal Shock Test Chamber
The thermal shock chamber tests how material structures or composites withstand rapid alternation between high- and low-temperature environments. It generally evaluates electrical and electronic products, semiconductors, circuit boards and metals under abrupt temperature changes. During development it can reveal design and process defects; it may also be used for environmental stress screening to eliminate early failures.
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Overview
Specifications
| Parameter | Value |
|---|---|
| High-Temperature Chamber Temperature Range [Custom Nonstandard Versions Available 180℃,200℃] | +60℃～+200℃(Custom Nonstandard Versions Available 180℃,200℃) |
| Low-Temperature Bath Temperature Range [A] | A(-55℃～-10℃) |
| Low-Temperature Bath Temperature Range | B(-65℃～-10℃) |
| Low-Temperature Bath Temperature Range [C] | C(-80℃～-10℃) |
| Heating time [+60℃～+200℃] | +60℃～+200℃≤35 min |
| Cooling Time [A(+20℃～-55℃)] | A(+20℃～-55℃)≤70min |
| Cooling Time [B(+20℃～-65℃)] | B(+20℃～-65℃)≤80min |
| Cooling Time [C(+20℃～-80℃)] | C(+20℃～-80℃)≤90min |
| Test Mode | Pneumatic Switching, Moving-Basket Type |
| Impact Recovery Time | ≤5min |
| Basket Transfer Time | Within 10 S |
Key Features
Datasheet
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