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PCT High-Pressure Accelerated Aging Test Chamber
Other Measurement Instruments

PCT High-Pressure Accelerated Aging Test Chamber

Supplier
Riukai
Category
Other Measurement Instruments
Origin
China

Ruikai's PCT pressure-accelerated aging chamber meets IEC60068-2-66, JESDEC-A110 and A118. Three control modes are unsaturated dry/wet-bulb temperature control, unsaturated heating-temperature control and moist saturated control. Moisture-related failures include ingress, polymer depolymerization, reduced polymer bonding, corrosion, voids, wire-bond separation, interlead leakage, chip/die-attach delamination, pad corrosion and metallization/interlead shorts. Electronic-package effects include corrosion failure, delamination/cracking and changes in molding-material properties. PCB failure modes: blistering, cracking and solder-resist delamination. Semiconductor PCT tests package moisture resistance under severe temperature, humidity and pressure. Poor sealing allows ingress through resin or resin/leadframe interfaces, causing popcorn effects, corrosion-related metallization opens and contamination-related interpin shorts. IC evaluation covers DA Epoxy, leadframe materials and encapsulating resin. Moisture, bias and impurity ions cause electrochemical aluminum-wire corrosion, opens and migration growth. Aluminum/alloys are used for low cost and simple processing. Moisture enters epoxy from the start of molding, causing corrosion/opens and quality-control difficulties. Different epoxies, improved molding and passivation films have been pursued, but miniaturization keeps aluminum corrosion a major challenge. Process: ① Moisture enters the plastic package and resin/wire gaps; ② It reaches the chip and reacts with aluminum. Accelerating factors: ① Poor resin/chip-frame bonding due to different expansion rates; ② Encapsulant impurities/ionic contamination; ③ High phosphorus concentration in passivation films; ④ Film defects. Popcorn effect: Silver die-attach paste absorbs moisture. If sealed without precautions, downstream soldering heat vaporizes the moisture, rupturing the package with a popping sound. It occurs above 0.17% absorbed moisture. In P-BGA packages, both silver adhesive and substrate absorb water, causing similar failures if poorly controlled. Entry paths: 1. Water absorbed by chips, leadframes and SMT silver paste; 2. Water absorbed by molding compound; 3. High molding-room humidity; 4. Post-encapsulation diffusion through compound and mechanical-bond gaps at leadframes. Gaps larger than 3.4*10^-10m allow water molecules through the encapsulation. Hermetic packages are moisture-insensitive and are normally evaluated by hermeticity/internal moisture tests rather than accelerated temperature/humidity testing.

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Overview

Ruikai's PCT pressure-accelerated aging chamber meets IEC60068-2-66, JESDEC-A110 and A118. Three control modes are unsaturated dry/wet-bulb temperature control, unsaturated heating-temperature control and moist saturated control. Moisture-related failures include ingress, polymer depolymerization, reduced polymer bonding, corrosion, voids, wire-bond separation, interlead leakage, chip/die-attach delamination, pad corrosion and metallization/interlead shorts. Electronic-package effects include corrosion failure, delamination/cracking and changes in molding-material properties. PCB failure modes: blistering, cracking and solder-resist delamination. Semiconductor PCT tests package moisture resistance under severe temperature, humidity and pressure. Poor sealing allows ingress through resin or resin/leadframe interfaces, causing popcorn effects, corrosion-related metallization opens and contamination-related interpin shorts. IC evaluation covers DA Epoxy, leadframe materials and encapsulating resin. Moisture, bias and impurity ions cause electrochemical aluminum-wire corrosion, opens and migration growth. Aluminum/alloys are used for low cost and simple processing. Moisture enters epoxy from the start of molding, causing corrosion/opens and quality-control difficulties. Different epoxies, improved molding and passivation films have been pursued, but miniaturization keeps aluminum corrosion a major challenge. Process: ① Moisture enters the plastic package and resin/wire gaps; ② It reaches the chip and reacts with aluminum. Accelerating factors: ① Poor resin/chip-frame bonding due to different expansion rates; ② Encapsulant impurities/ionic contamination; ③ High phosphorus concentration in passivation films; ④ Film defects. Popcorn effect: Silver die-attach paste absorbs moisture. If sealed without precautions, downstream soldering heat vaporizes the moisture, rupturing the package with a popping sound. It occurs above 0.17% absorbed moisture. In P-BGA packages, both silver adhesive and substrate absorb water, causing similar failures if poorly controlled. Entry paths: 1. Water absorbed by chips, leadframes and SMT silver paste; 2. Water absorbed by molding compound; 3. High molding-room humidity; 4. Post-encapsulation diffusion through compound and mechanical-bond gaps at leadframes. Gaps larger than 3.4*10^-10m allow water molecules through the encapsulation. Hermetic packages are moisture-insensitive and are normally evaluated by hermeticity/internal moisture tests rather than accelerated temperature/humidity testing.

Specifications

ParameterValue
Temperature Range [Saturated Vapor Temperature]100℃ → +132℃( Saturated Vapor Temperature ) or 100℃ → +143℃( Saturated Vapor Temperature )
Pressure Range0.2～2㎏/㎝2(0.05～0.196MPa) or 0.2～3㎏/㎝2(0.05～0.294MPa)
Pressurization Timeapproximately 55min
Temperature Uniformity≤±0.5℃
Temperature Fluctuation≤±0.5℃
Humidity Range [Saturated Vapor Humidity]100%RH(Saturated Vapor Humidity)

Applications

PCT pressure-aging chamber has a vessel/water heater producing 100% humidity and 100℃ → +143℃; condensed steam penetration can cause PCT failures. PCT pressure-cooker/saturated-steam tests place samples under severe temperature, saturated 100%R.H. steam, and pressure to assess humidity resistance/moisture uptake and high-pressure steaming of PCB&FPC, IC, metals, and related materials.

Key Features

Safer standard design: rounded inner chamber prevents condensation drips and complies with national safety-vessel requirements. In-house technology: large color LCD touchscreen controller; side cable port facilitates external-load and internal-data connections, with network monitoring through optional interfaces. Fully automatic water replenishment: the system adds all required test water at startup for uninterrupted testing. Low-noise design: operating noise as low as 65db.

Datasheet

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Supplier Information

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Riukai
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Dongguan Ruikai Environmental Testing Instrument Co., Ltd. (hereinafter referred to as "Ruikai Instrument") is located in Hengli Town, Dongguan City, Guangdong Province. It is a high-tech enterprise integrating the design, research and development, production, sales, and service of simulated environmental reliability testing equipment, and is also a professional testing equipment manufacturer and comprehensive testing solution service provider. The company's products have passed ISO 9001:2015 quality management system certification, ISO 14001 environmental management system certification, ISO 45001 occupational health and safety management system certification, EU CE certification, and metrological assurance system certification. It maintains long-term in-depth cooperation with many well-known metrological testing institutions in China and fully implements industry quality standards. The company has more than 50 technical patents and has been awarded the title of Dongguan Innovative Private Demonstration Enterprise. The company's main products include HAST test chambers, PCT test chambers, highly accelerated stress test machines, unsaturated highly accelerated stress test machines, rapid temperature change test chambers, thermal shock test chambers, constant temperature and humidity test chambers, high and low temperature test chambers, etc. It also supports customization of various large-scale non-standard complex environmental testing equipment and ODM cooperation. The company has successively established offices in Dongguan, Suzhou, Changsha, Beijing, Xi'an, and other places, building a complete marketing network and after-sales service system nationwide, and has accumulated a good brand reputation in the domestic industry. Products are widely used in many fields such as university research, aviation manufacturing, electronic optoelectronics, electrical, plastics, hardware, new energy batteries, communications, automobiles, etc., serving a large number of well-known industry enterprises and scientific research testing institutions, and gaining wide recognition. The company focuses on the exchange and accumulation of advanced technology and has built a high-quality R&D team. With technical strength and the enterprising spirit of continuous innovation, Ruikai Instrument's new generation products are presented to the market with a new look of intelligent control, energy saving and environmental protection, high reliability, fine workmanship, and elegant appearance. The production process strictly implements the requirements of the ISO9001:2015 quality management system, and the equipment complies with many domestic and international testing standards such as GB, GJB, IEC, BS, ASTM, UL, JIS, CE, etc. Since its establishment, Ruikai Instrument has always adhered to the business philosophy of hard work, innovation, integrity and pragmatism, committed to providing customers with reliable products and practical services, building a platform for employees to realize their life value, and striving to create a brand with sustainable development. Ruikai Instrument is willing to work hand in hand with colleagues in the industry and sincerely looks forward to your support and cooperation.

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