Solderwell

Guangzhou Solderwell Microelectronic Packaging Materials Co., Ltd., founded in 1999, has been deeply engaged in electronic materials for over 25 years. It is a manufacturer of advanced semiconductor packaging and interconnection materials, focusing on the R&D, innovation, and production of sintered silver paste/film, sintered copper paste, IGBT solders, gold-tin solders, coating solders, aluminum-based brazing materials, solder pastes, etc. The company is committed to providing global customers with high-performance products and overall application solutions. Its products are widely used in semiconductor packaging, power battery packaging, high-end electronic assembly, surface mount of printed circuit boards, assembly plug-ins, hot air leveling, and electroplating. It enjoys a good reputation in communications, new energy, semiconductor packaging, aerospace, AI servers, power and electric, and other fields, with a stable high-quality customer base.