100G EML
Dingxin Optoelectronics has independently developed an electroabsorption distributed-feedback laser diode chip. Each chip has bandwidth exceeding 35GHz for 100G PAM4 requirements. It offers high bandwidth, high power and low threshold, with wavelength coverage of 1271-1331nm.
Specification Snapshot
Threshold Current Ith [CW;Tc=45℃]
typical:12 mA; max:20 mA
Center Wavelength λ0 [CW, Iop=80mA;Tc=45℃]
min:1269 nm; typical:1271 nm; max:1274 nm
Center Wavelength λ1 [CW, Iop=80mA;Tc=45℃]
min:1289 nm; typical:1291 nm; max:1294 nm
Center Wavelength λ2 [CW, Iop=80mA;Tc=45℃]
min:1309 nm; typical:1311 nm; max:1314 nm
Center Wavelength λ3 [CW, Iop=80mA;Tc=45℃]
min:1329 nm; typical:1331 nm; max:1334 nm
Side-mode Suppression Ratio SMSR [CW,Iop=80mA;Tc=45℃]
min:35 dB; typical:45 dB
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Overview
Dingxin Optoelectronics has independently developed an electroabsorption distributed-feedback laser diode chip. Each chip has bandwidth exceeding 35GHz for 100G PAM4 requirements. It offers high bandwidth, high power and low threshold, with wavelength coverage of 1271-1331nm.
Specifications
| Parameter | Value |
|---|---|
| Threshold Current Ith [CW;Tc=45℃] | typical:12 mA; max:20 mA |
| Optical Output Power [CW,Iop=80mA;Tc=45℃] | min:12 mW |
| Laser Forward Voltage Vf [CW,Iop=80mA;Tc=45℃] | max:2.0 V |
| Center Wavelength λ0 [CW, Iop=80mA;Tc=45℃] | min:1269 nm; typical:1271 nm; max:1274 nm |
| Center Wavelength λ1 [CW, Iop=80mA;Tc=45℃] | min:1289 nm; typical:1291 nm; max:1294 nm |
| Center Wavelength λ2 [CW, Iop=80mA;Tc=45℃] | min:1309 nm; typical:1311 nm; max:1314 nm |
| Center Wavelength λ3 [CW, Iop=80mA;Tc=45℃] | min:1329 nm; typical:1331 nm; max:1334 nm |
| Side-mode Suppression Ratio SMSR [CW,Iop=80mA;Tc=45℃] | min:35 dB; typical:45 dB |
| Static Extinction Ratio DCER [Vea=-2V;Tc=45℃] | min:9 dB |
| 3dB Bandwidth BW [Iop=80mA Vea=Best linearity point;Tc=45℃] | min:30 GHz |
| Far-field Angle (FWHM) θ// [Tc=45℃] | typical:28 Deg |
| Far-field Angle (FWHM) θ⊥ [Tc=45℃] | typical:38 Deg |
Applications
Data Communication Ethernet Communication
Key Features
Monolithically Integrated Chip with DFB Laser and EA Modulator High Extinction Ratio High Modulated Rate Low Threshold High Reliability
Datasheet
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Supplier Information
Suzhou Dingxin Optoelectronic Technology Co., Ltd. is dedicated to the R&D and manufacturing of high-performance integrated optical chips. It possesses an industry-leading compound semiconductor process line supporting 3/4/6-inch wafer mass production, with capabilities covering chip design, crystal material growth, wafer fabrication, testing and packaging, providing one-stop solutions from wafer to device. Adopting an IDM model, the company enforces strict reliability standards. Its product portfolio includes EML, communication DFB, silicon photonics DFB, sensing, narrow linewidth laser chips, etc., applied in telecom, datacom, LiDAR, methane detection, and offers customized design and foundry services.
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